BS EN 60191-6-21:2010 PDF
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 декабря 2010 г.
- ICS:
- 25.040.40
- Технический комитет:
- CENELEC
- SKU:
- BS EN 60191-6-21:2010