Semiconductor devices. Micro-electromechanical devices - Tensile testing method of thin film materials
Semiconductor devices. Micro-electromechanical devices - Tensile testing method of thin film materials
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What is BS EN 62047-2 — Micro-electromechanical devices about?
BS EN 62047-2 is the second part of the multi-series standard that focuses on aspects of semiconductor devices. BS EN 62047-2 specifies the tensile testing method of thin-film materials used in micro-electromechanical devices. It gives method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 mm, which are the main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have specific features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography.
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