1 Scope
This part of IEC 60068‑2 establishes test methods for the resistance of electronic and electromechanical components,
unpopulated circuit boards and assemblies to liquid cleaning media and cleaning processes,
which are agreed between user and supplier for applications, where cleaning is required.
These tests are not applicable to components, unpopulated circuit boards and assemblies,
which are not intended to be subjected to cleaning processes.
Tests XD 1 and XD 2 primarily are intended for qualification testing of components and unpopulated circuit
boards suitable for cleaning processes but can be adopted as well to testing of material
compatibility and specific cleaning media used in manufacturing processes of components and unpopulated
circuit boards.
Test XD 3 is intended to determine the resistance of electronic assemblies suitable for cleaning
processes to the various cleaning processes to which they are exposed during manufacturing,
including the effects of assembly and soldering processes.