BS EN IEC 61189-5-601:2021 PDF
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…
Название (английский):
BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for…
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 31 марта 2021 г.
- ICS:
- 19.080
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-5-601:2021