Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
Semiconductor devices. Micro-electromechanical devices - Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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What is BS IEC 62047 ‑ 31 - Micro-electromechanical systems (MEMS) materials about ? BS IEC 62047 ‑ 31 is the 31st part of an international standard used for semiconductor devices that specifies the bending test method. This test method helps in measuring the interfacial adhesion energy in microelectromechanical devices. BS IEC 62047-31 is a four-point bending test method for interfacial adhesion energy of layered MEMS materials. BS IEC 62047-31 specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics.
Who is BS IEC 62047 ‑
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