Semiconductor devices. Micro-electromechanical devices - Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Semiconductor devices. Micro-electromechanical devices - Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Мы хотим включить аналитику посещений, чтобы понимать, что искать людям на сайте. Без вашего согласия счётчики не загружаются. Политика конфиденциальности
What is BS IEC 62047 ‑ 36 - Test methods for MEMS piezoelectric thin films about?
BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim of the IEC 62047 series is to provide entities involved with semiconductor technology with best industry techniques to demonstrate the reliability and performance of their devices and components. BS IEC 62047 ‑ 36 is the 36th part of the series that specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, BS IEC 62047 ‑ 36 specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used as actuators. Note: BS IEC 62047 ‑ 36 does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.
Who is BS IEC 62047 ‑ 36 - Test methods for MEMS piezoelectric thin films for?
BS IEC 62047 ‑ 36 on MEMS piezoelectric thin films
Упомянутые в описании и другие стандарты BS