Semiconductor devices. Micro-electromechanical devices - Environmental test methods of MEMS piezoelectric thin films for sensor application
Semiconductor devices. Micro-electromechanical devices - Environmental test methods of MEMS piezoelectric thin films for sensor application
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1 Scope
This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors. This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.
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