Semiconductor devices. Micro-electromechanical devices - Temperature and humidity test methods for piezoelectric MEMS cantilevers
Semiconductor devices. Micro-electromechanical devices - Temperature and humidity test methods for piezoelectric MEMS cantilevers
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1 Scope This part of IEC 62047 specifies reliability test methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is typical structure of micro sensors and micro actuators. In order to estimate the stability of the piezoelectric coefficient of the piezoelectric thin films with microscale structures in the operating conditions, this document reports the schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric MEMS devices. This document applies to piezoelectric thin films on microcantilever fabricated by MEMS process.
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