Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
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1 Scope This part of IEC 62047 specifies a testing method for measuring device performance and failure strain under biaxial tensile deformation in stretchable MEMS materials. The typical examples of the stretchable MEMS materials are flexible single crystalline silicon structures, MEMS circuit boards, interconnected MEMS on a stretchable substrate. The test piece has a cruciform geometry and the test piece thickness ranges from 1 μm to 100 μm with the same thickness as the actual devices. Since the failure strain can vary depending on loading conditions like uniaxial tension and equi-biaxial tension, a biaxial load is applied to a cruciform test piece with varying strain ratio between two perpendicular loading directions.
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