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Found: 9 942
Country: 🌐 International standards
Fibre optic sensors - Generic specification
Electromechanical all-or-nothing relays - Part 52: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 20 mm x 10 mm base
Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification: Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 28: Type LF3 connector family
Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests
Energy management system application program interface (EMS-API) - Part 1: Guidelines and general requirements
Smart city use case collection and analysis - City information modelling - Part 2: Use case analysis
Semiconductor devices - Discrete devices - Part 7: Bipolar transistors
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
Reliability stress screening - Part 2: Components
Three-digit code for designation of colour rendering and correlated colour temperature
Combined flexible materials for electrical insulation - Part 1: Definitions and general requirements
Passive filter units for electromagnetic interference suppression - Part 2: Sectional specification - Passive filter units for which safety tests are appropriate - Test methods and general requirements
Coaxial communication cables - Part 1-124: Electrical test methods - Test for coupling loss of radiating cable
Connectors for electronic equipment - Tests and measurements - Part 2-1: Electrical continuity and contact resistance tests - Test 2a: Contact resistance - Millivolt level method
Fibre-optic communication subsystem test procedures - Part 4-5: Installed cabling plant - Attenuation measurement of MPO terminated fibre optic cabling plant using test equipment with MPO interfaces
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-20: Examinations and measurements - Directivity of fibre optic branching devices
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
