What is DD IEC/PAS 61249-3-1 ‒ Copper-clad laminates for flexible boards about?
DD IEC/PAS 61249-3-1 is an international standard that focuses on the copper-clad laminates and interconnecting structure of the printed board.
DD IEC/PAS 61249-3-1 specifies the properties of copper-clad laminates used for flexible boards for both adhesive and non-adhesive types.
DD IEC/PAS 61249-3-1 stipulates the technicalities such as related terms and definitions, designation of copper-clad laminate, observation, size of the base film and copper foil, adhesives, properties, package, labelling, as well as roughness test, and dimensional tests are given for copper-clad laminates for flexible boards.
Who is DD IEC/PAS 61249-3-1 ‒ Copper-clad laminates for flexible boards for ?
DD IEC/PAS 61249-3-1 on the copper-clad laminates for flexible boards is useful for:
Manufacturers of printed circuit boards (PCBs)
Manufacturers of electronic components and interconnecting structures
Manufacturers and suppliers of laminate sheets
Quality control and testing personnel
Regulatory authorities