Organic polymer materials for the assembly, protection and sealing of semiconductor devices and integrated circuits. Classification and composition of physical and chemical characteristics

Description in Russian:
Материалы органические полимерные для сборки, защиты и герметизации полупроводниковых приборов и интегральных схем. Классификация и состав физико-химических характеристик

Document status:

Active

Format:

Electronic (PDF)

Page count:

Delivery time (for English version):

4 business days

Delivery time (for Russian version):

1 business day

SKU:

GOST47798

GOST R 70745-2023

Organic polymer materials for the assembly, protection and sealing of semiconductor devices and integrated circuits. Classification and composition of physical and chemical characteristics

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