Overview
IEC 60068-2-83:2011 is an international standard published by the International Electrotechnical Commission (IEC) that specifies environmental testing methods for the solderability of electronic components designed for surface mounting devices (SMD). This standard focuses on solderability testing using the wetting balance method with solder paste to assess the wettability of metallic terminations or metallized surfaces of SMDs.
Its primary aim is to provide comparative evaluation techniques rather than absolute pass/fail criteria. It complements other solderability test standards for SMDs such as IEC 60068-2-58 and IEC 60068-2-69, which use visual evaluation and solder bath methods.
Key Topics
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Solderability Testing via Wetting Balance Method: Utilizes the wetting balance approach with solder paste rather than solder bath, offering a precise measurement of interaction between solder paste and component terminals.
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Test Methods Included:
- Quick Heating Method: Rapid heating of solder paste for wetting balance assessment.
- Synchronous Method: Synchronized measurement technique improving repeatability.
- Temperature Profile Method: Tests solderability following predefined temperature profiles to simulate different reflow conditions.
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Test Equipment and Procedures:
- Specifications for test jig plates, specimen holders, and fixtures are outlined to ensure consistency.
- Detailed guidelines on solder paste preparation, application, heating, and immersion/withdrawal conditions.
- Measurement and interpretation of wetting forces to characterize solderability performance.
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Preconditioning: Recommendations for component and equipment preparation to minimize variability.
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Data Analysis:
- Interpretation of wetting force curves.
- Parameter examples include initial wettability time, maximum wetting force, and overall wetting performance.
- Correction techniques to accommodate irregularities in test data.
Applications
IEC 60068-2-83:2011 is essential for manufacturers, quality assurance engineers, and testing laboratories involved in electronic assembly and surface mount technology (SMT). Its practical uses include:
- Comparative evaluation of solder pastes and flux formulations for optimal component assembly.
- Quality control of SMD components by assessing surface finish quality and compatibility with solder pastes.
- Development and benchmarking of reflow soldering processes, ensuring reliable solder joints.
- Supporting component and PCB supplier certifications with controlled solderability test results.
- Enhancing failure analysis by investigating solderability issues causing assembly defects.
This standard helps improve assembly yields, reduce solder joint failures, and optimize manufacturing reliability in electronics production environments.
Related Standards
- IEC 60068-2-58: Environmental testing methods - solderability testing of electronic components for SMD by visual evaluation using solder bath and reflow methods.
- IEC 60068-2-69: Environmental testing methods - solderability testing of electronic components for SMD using the wetting balance method with solder bath and solder globule.
- IEC 60068 Series: Covers a wide range of environmental testing standards for electronic components, ensuring comprehensive reliability assessment.
- ISO 9452 / J-STD-002: Industry-recognized standards for solderability and solder joint quality testing.
By following IEC 60068-2-83, electronic manufacturers can establish robust, reproducible solderability tests aligned with global best practices, ultimately supporting higher product quality and compliance in surface mount electronic component assembly using solder paste and wetting balance techniques.