Overview
IEC 60191-6-18:2010 outlines the mechanical standardization of semiconductor device packages, focusing specifically on surface mounted ball grid array (BGA) packages with a terminal pitch of 1 mm or larger. Developed by the International Electrotechnical Commission (IEC), this standard provides a comprehensive design guide for the preparation of outline drawings, ensuring uniformity in BGA package dimensions and recommended variations. It aims to facilitate the interchangeability and compatibility of BGA packages across the semiconductor industry.
This first edition cancels and replaces the previous IEC/PAS 60191-6-18:2008 and integrates all corrigenda up to July 2010. By offering clear and internationally recognized guidelines, IEC 60191-6-18:2010 helps manufacturers and users maintain consistent quality, reliability, and efficiency in the design and assembly of BGA packages.
Key Topics
- Scope and Purpose: Covers all square BGA packages with terminal pitches of 1 mm or more, providing standard outline drawings, critical dimensions, and recommended BGA variations to reduce unnecessary proliferation of package types.
- Types of BGA Packages: Includes plastic BGA (P-BGA), tape BGA (T-BGA), and ceramic BGA (C-BGA), each with specific substrate materials and interconnection characteristics.
- Outline Drawings and Symbols: Specifies general rules for outlining, including positional numbering systems, matrix dimensions, and standard symbols in line with IEC 60191-6.
- Dimensional Specifications: Sets out detailed dimensional requirements for package width, length, profile height, terminal pitch, ball diameter, stand-off heights, and tolerance specifications to ensure consistency.
- Terminal Numbering System: Describes a grid-based alphanumeric system for terminal identification, enhancing clarity in assembly and testing processes.
- Recommended BGA Variations: Provides tables with recommended combinations of package sizes, pitches, and ball counts to help streamline manufacturing choices.
Applications
IEC 60191-6-18:2010 is essential for a variety of applications within the electronics and semiconductor sectors:
- Semiconductor Package Design: Guides engineers in designing BGA packages that meet international uniformity and compatibility requirements, minimizing design errors and improving product reliability.
- Quality Control and Manufacturing: Provides manufacturers with standardized measurements and tolerance guidelines for mass production, leading to improved process control and quality assurance.
- Procurement and Supply Chain: Enables purchasers and component suppliers to specify and source BGA packages with confidence in cross-vendor compatibility and adherence to global standards.
- PCB Assembly and Testing: Facilitates the accurate placement and inspection of BGAs on printed circuit boards by providing precise outline definitions and terminal layouts.
- Product Interchangeability: Supports engineers and designers in selecting alternate BGA packages without extensive redesign, thus reducing time-to-market and overall cost.
Related Standards
For comprehensive mechanical standardization, the following IEC standards are closely related to IEC 60191-6-18:2010:
- IEC 60191-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.
- IEC 60191-6-2: Design guide for 1.50 mm, 1.27 mm, and 1.00 mm pitch ball and column terminal packages.
- IEC 60191-6-4: Measuring methods for package dimensions of ball grid array (BGA).
- IEC 60191-6-5: Design guide for fine-pitch ball grid array (FBGA) packages.
These related standards provide additional requirements and guidance for other BGA variants, measurement methodologies, and further details around mechanical standardization of semiconductor packages.
By adopting IEC 60191-6-18:2010, organizations benefit from improved mechanical compatibility, streamlined supply chains, and enhanced reliability in the use and integration of BGA packages in modern electronics. This standard is indispensable for anyone involved in semiconductor design, manufacturing, and electronic product assembly where BGA packages are used.