IEC 61188-1-2:1998 PDF
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
Название (английский):
IEC 61188-1-2:1998
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 83
- Дата публикации:
- 29 апреля 1998 г.
- Издание:
- IEC IS 61188 edition 1 version 1
- ICS:
- 31.180
Описание (английский):
The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61188-1-2:1998