IEC 61188-5-1:2002 PDF
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Название (английский):
IEC 61188-5-1:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
- Формат:
- Электронный (PDF)
- Количество страниц:
- 141
- Дата публикации:
- 12 июля 2002 г.
- Издание:
- IEC IS 61188 edition 1 version 1
- ICS:
- 01
- Технический комитет:
- TC 91 - Electronics assembly technology
Описание (английский):
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
Технические детали
- SKU
- IEC 61188-5-1:2002