IEC 61189-5:2006 PDF
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Название (английский):
IEC 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 62
- Дата публикации:
- 29 августа 2006 г.
- Издание:
- IEC IS 61189 edition 1 version 1
- ICS:
- 31.180
Описание (английский):
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61189-5:2006