IEC 61192-3:2002 PDF
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Название (английский):
IEC 61192-3:2002
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 93
- Дата публикации:
- 17 декабря 2002 г.
- Издание:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
Описание (английский):
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-3:2002