Overview
IEC 63055:2016 (IEEE Std 2401) defines a common, interoperable format for LSI–Package–Board (LPB) design. The standard establishes a shared way to describe project management data, netlists, components, design rules, and physical geometries for large-scale integration (LSI) devices, their packages, and the printed circuit boards (PCBs) that interconnect them. Published as a double‑logo IEC–IEEE standard, IEC 63055 promotes consistent data exchange across semiconductor, packaging, and PCB design domains.
Key topics and technical requirements
- LPB format structure: A modular, tag/elements‑based format (examples in the standard include M‑Format, C‑Format, R‑Format, N‑Format, G‑Format) to represent modules, components, physical design, nets, and geometry.
- Common elements: Header and global metadata for project management and consistent identification of design files.
- Netlists and connectivity: Formal representation of nets and net attributes to support interoperability between IC, package, and board design tools.
- Component and package descriptions: Standardized component records and padstack/part definitions to reduce ambiguity in component placement and interfaces.
- Physical geometry and layer definitions: Layer, shape, board geometry, via and route descriptions to enable accurate transfer of manufacturing and layout data.
- Design rules and constraints: Constraint rule elements for electrical and physical design requirements (clearance, routing, bondwire, etc.).
- Verification & integrity: Annexes cover practical tooling topics such as XML encryption, MD5 checksum, and example use cases and test benches to validate format conformance.
- Examples and usage guidance: Informative annexes provide sample files, design flow examples, and simulation/test bench guidance.
Practical applications
- Exchange of design data among IC designers, package engineers, and PCB/layout teams
- Enabling multi‑discipline co‑design (chip ↔ package ↔ board) and reducing translation errors
- EDA tool interoperability and data handoff between CAD/EDA applications
- Supporting manufacturability checks, simulation setups, test bench generation, and verification workflows
- Standardizing interfaces for supply‑chain collaboration and outsourced manufacturing
Who should use this standard
- EDA tool vendors and integrators implementing LPB import/export
- Semiconductor design teams (LSI/IC designers)
- Package and substrate designers
- PCB/layout engineers and CAD teams
- Manufacturers, test engineers, and systems integrators that consume cross‑domain design data
- Standards and quality assurance teams seeking consistent data interchange
Keywords: IEC 63055, IEEE Std 2401, LPB format, LSI‑Package‑Board interoperable design, netlist exchange, PCB geometry, package design, design rules, EDA interoperability.