Overview
IEC 63055:2023 (also published as IEEE Std 2401) defines a common, interoperable file format for integrated design data spanning Large‑Scale Integration (LSI) devices, their packages, and the printed circuit boards (PCBs) that interconnect them - collectively called LSI‑Package‑Board (LPB) designs. The standard standardizes how project management data, netlists, components, design rules, and geometric descriptions are represented to enable reliable exchange between EDA/CAD tools, design teams, and manufacturing partners. This IEC/IEEE dual‑logo standard supports multi‑discipline collaboration and tool interoperability across the LPB supply chain.
Key topics and technical scope
IEC 63055 covers file structures, language conventions and multiple specialized formats for LPB data, including:
- Format families: M‑Format, C‑Format, R‑Format, N‑Format, and G‑Format (each with specific roles in bundling, component/module description, physical constraints, power/ground identification, and geometry).
- Common elements: header, global metadata, file naming, and extension mechanisms to manage file sets and versions.
- Design content types: project management metadata, netlists, components, padstacks, part/component definitions, layer and material descriptions, board geometry, vias, bondwires, and routing.
- Design rules and constraints: constraint rule elements and physical design elements for describing manufacturability and electrical/physical constraints.
- Language and syntax basics: typographic and character conventions, floating point notation, and recommended naming conventions.
- Security and integrity: informative guidance on XML encryption and MD5 checksums (integrity), plus annexes with examples and usage scenarios.
- Informative annexes: test benches, design flow examples, bundling and versioning examples, chip‑package interface considerations, and participants.
Practical applications and users
IEC 63055 is intended to accelerate interoperability and reduce integration errors in multidisciplinary electronic system design. Typical applications:
- Exchanging LPB design data between IC designers, package engineers, and PCB designers
- Enabling EDA and CAD tool interoperability for simulation, verification, and manufacturing data handoff
- Building reusable component/libraries, version control of multi‑file design bundles, and automated test benches
- Supporting supply‑chain collaboration: manufacturers, assemblers, and test houses using a consistent netlist/geometry format
Who benefits: EDA vendors, semiconductor companies, package houses, PCB fabricators, systems integrators, test engineers, and project managers seeking consistent, machine‑readable LPB data.
Related standards and keywords
- Dual logo: IEC 63055:2023 / IEEE Std 2401
- Relevant keywords: LSI‑Package‑Board, LPB Format, interoperable design format, netlist exchange, padstack, bondwire, via, PCB geometry, EDA interoperability, design rules, project metadata.