IEC PAS 62307:2002 PDF
Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
Название (английский):
IEC PAS 62307:2002
Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
- Статус документа:
- product.statusDraft
- Формат:
- Электронный (PDF)
- Количество страниц:
- 9
- Дата публикации:
- 12 марта 2002 г.
- Издание:
- IEC PAS 62307 edition 1 version 1
- ICS:
- 31.200
Описание (английский):
Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
Технические детали
- Технический комитет
- TC 47 - Semiconductor devices
- SKU
- IEC PAS 62307:2002