Overview
IEC PAS 63702:2026, developed by the International Electrotechnical Commission (IEC), presents a comprehensive classification for additive manufacturing (AM) and 3D printing processes specifically for electronics. As the electronics industry demands greater miniaturization and higher performance, AM technologies are increasingly vital. This standard provides foundational terminology, structure, and classification to facilitate universal understanding and application of AM processes within the electronics sector.
Key Topics
- Additive Manufacturing for Electronics: IEC PAS 63702:2026 distinguishes the unique requirements of electronic components, including the integration of conductive, semi-conductive, and non-conductive materials through layered printing processes.
- Five-Level Classification: The standard introduces a five-tier system for classifying AM applications, from basic 2D printed electronics to advanced 4D structures:
- Class 1: Basic 2D substrates with printed functional layers (e.g., solder mask, sensors)
- Class 2: Multidimensional (3D) carriers with additive functional layers
- Class 3: 3D-printed substrates and electronic layers combined, enabling complex shapes and internal structures
- Class 4: Fully additively manufactured products including embedded components within the substrate
- Class 5: Shape-changing (4D) solutions, covering printed structures with active mechanical properties
- Material and Process Diversity: The standard discusses a variety of printing processes suitable for electronics, such as inkjet, aerosol jet, dispensing, and extrusion, and addresses challenges like matching materials to substrates and ensuring proper functional curing.
- Alignment with Industry Standards: It references established frameworks, such as ISO/ASTM 52900, to ensure broader compatibility across manufacturing and data exchange processes.
- Sustainability: AM processes in electronics can reduce material use, energy consumption, and transport, supporting sustainability initiatives.
Applications
The classification system and best practices outlined in IEC PAS 63702:2026 are relevant for a broad range of industrial applications in electronics manufacturing, including:
- Printed Electronics: From sensors and antennas to advanced electronic circuits on flexible, rigid, and stretchable substrates.
- 3D Electronic Assemblies: Facilitates the creation of complex, multi-layer circuit carriers, especially valuable in compact devices and wearable technology.
- Rapid Prototyping and Customization: Enables fast, tool-free prototyping and short-run production of electronic components tailored to specific requirements.
- Integration Density: Supports embedding electronic functions and components within 3D-printed structures, maximizing space utilization.
- Advanced Medical, Automotive, and Aerospace Electronics: Allows for innovative form factors, lightweight solutions, and functional integration previously not feasible with traditional methods.
- Sustainable Manufacturing: By using only the required material and reducing waste, these processes align with green manufacturing goals.
Related Standards
Organizations and professionals leveraging IEC PAS 63702:2026 should also consider the following related standards for full compatibility and optimized implementation:
- ISO/ASTM 52900: Fundamental terminology for additive manufacturing processes, providing a worldwide reference for AM methods.
- IEC 60068: Environmental testing standards for electronic equipment.
- IEC 61189: Testing methods for electronic materials and assemblies.
- ISO/IEC Directives: Framework for the development of international standards, including editorial and procedural guidelines.
- Industry 4.0 and Digital Manufacturing Standards: For interoperability of data formats, system integration, and smart manufacturing environments.
By providing a standardized approach to classifying additive manufacturing in electronics, IEC PAS 63702:2026 acts as a cornerstone for innovation, quality assurance, and international collaboration in the fast-evolving field of 3D-printed electronics.