Overview
IEC TR 62658:2013 provides a comprehensive roadmap for the development and standardization of optical circuit boards and their associated packaging technologies. Published by the International Electrotechnical Commission (IEC), this technical report outlines the technological landscape, performance trends, and relevant supporting components such as optical circuit board connectors and opto-electronic modules. The roadmap aims to support the global transition from conventional electrical printed circuit boards (PCBs) to advanced optical alternatives that meet the escalating demand for higher data transmission rates, energy efficiency, and integration in next-generation networking, server, and data storage applications.
Keywords: optical packaging technology roadmap, roadmap of optical circuit boards, opto-electronic modules, optical board connectors, IEC TR 62658.
Key Topics
Applications
The standardization roadmap outlined in IEC TR 62658:2013 has practical implications across a breadth of high-performance electronic systems:
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Data Centers and Cloud Computing:
- Enhances data transmission efficiency and supports scaling of server and storage architectures
- Reduces power consumption and improves sustainability in large-scale data operations
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High-Speed Networking Equipment:
- Enables next-generation routers, switches, and backbone infrastructure to overcome limitations of electrical interconnects
- Supports higher bandwidth and greater channel density essentials for ever-increasing network traffic
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High-Performance Computing (HPC):
- Facilitates tighter integration and higher bandwidth between processors and memory, catering to complex computations and real-time data processing
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Telecommunications:
- Optical packaging technologies support the increasing demand for bandwidth in both core and access networking environments
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Green IT Initiatives:
- Optical interconnects play a pivotal role in reducing the energy footprint of electronic systems by lowering power consumption per transmitted bit
Related Standards
Professionals and organizations implementing or referencing IEC TR 62658:2013 should also consider associated standards that complement the roadmap for optical circuit board packaging technologies:
- IEC 62496-1: Optical circuit boards – Part 1: General
- IEC/TS 62661-2-1: Optical backplanes – Product specification for boards using optical fiber and multi-core connectors
- IEC 61754-25: Fibre optic connector interfaces – Type RAO connector family
- IEC 61754-26: Passive components – Fibre optic connector interfaces – Type SF connector family
These standards collectively provide detailed requirements, test methods, and technical specifications necessary for the successful deployment and integration of optical packaging technologies in a variety of electronic and communication systems.
For ongoing updates on standardization and technology advancements, consulting the IEC TC86 publications and activities is recommended.