Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
Environmental testing - Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
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What is PD IEC/TR 60068-3-12 - Lead-free solder reflow temperature profile about?
PD IEC/TR 60068-3-12 is a standard that covers lead-free solder reflow temperature profile, enabling the selection and application of reflow temperature profiles for improved soldering strength and performance in electronic components. PD IEC/TR 60068-3-12 is a technical report, that presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. PD IEC/TR 60068-3-12 process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). In PD IEC/TR 60068-3-12 , study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances.
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