Field-effect transistors. Forward fransconductance impulse measurement technique
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Information technology. Open systems interconnection. Conformance test suite for the presentation layer. Part 1. Test suite structure and test purposes for the presentation protocol
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Materials for printed boards and other interconnecting structures. Part 2-7. Reinforced base materials clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
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Modular order for the development of mechanical structures for electronic equipment practices. Part 2. Sectional specification. Interface coordination dimensions for the 25 mm equipment practice. Section 1. Detail specification. Dimensions for cabinets and racks
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Containers for motion picture films, film material and magnetic tapes. Specifications
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