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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding stre…

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement…

Overview The IEC 62047-9:2011 standard provides a comprehensive methodology for measuring wafer-to-wafer bonding strength specifically tailored for Micro-Electromechanical Systems (MEMS). This intern…