ISO TS 10303-1670-2006 PDF
Name in English:
St ISO TS 10303-1670-2006
Name in Russian:
Ст ISO TS 10303-1670-2006
Original standard ISO TS 10303-1670-2006 in PDF full version. Additional info + preview on request
Full title and description
St ISO TS 10303-1670-2006 — Industrial automation systems and integration — Product data representation and exchange — Part 1670: Application module: Fabrication technology. This Technical Specification (part of the ISO 10303 "STEP" family) defines an application module for representing fabrication-technology information used when designing interconnect substrates, including layout templates and layer stack models for multiple material combinations.
Abstract
ISO/TS 10303-1670:2006 specifies an application module that captures the information required to describe fabrication technology for interconnect substrates. The module supports representation of fabrication technology properties, simple and complex layout pattern templates and their properties, and a stratum (layer) stack model capable of representing technology-specific layer stackups and multiple material combinations.
General information
- Status: Withdrawn (superseded/revised).
- Publication date: December 2006 (2006-12).
- Publisher: International Organization for Standardization (ISO).
- ICS / categories: 25.040.40 (Industrial automation systems and integration / Product data representation and exchange).
- Edition / version: Edition 1 (2006).
- Number of pages: 48.
Scope
This part of ISO 10303 defines an application module for the computer-interpretable representation of fabrication-technology data related to interconnect substrate design. Within scope are: the definition and properties of fabrication technologies; representation of layout pattern templates and their attributes; and definition of stratum (layer) stack models to represent technology-specific layer arrangements and material combinations required for manufacturing and data exchange between CAD, analysis and manufacturing systems.
Key topics and requirements
- Representation of fabrication technology properties (material, process parameters, manufacturing capabilities).
- Definition and exchange of layout pattern templates (simple and complex) used in substrate/layout design.
- Specification of layout template properties and relationships to technology characteristics.
- Stratum (layer) stack model supporting multiple material combinations and non-uniform stackups across a substrate.
- Information requirements and an application reference model (ARM) mapping to a module interpreted model (MIM) for EXPRESS data types.
- Interoperability guidance for CAD, CAM and data-archiving systems exchanging fabrication-related data.
Typical use and users
Used by engineers and data-exchange specialists in electronics and interconnect substrate design, PCB and substrate CAD/CAM tool developers, manufacturing process engineers, data archivists and organizations implementing STEP-based product data exchange. Typical applications include exchanging fabrication rules and stackup definitions between design, analysis and manufacturing systems and standardizing technology templates for multi-vendor workflows.
Related standards
Part of the ISO 10303 (STEP) family. Closely related parts and modules include other ISO/TS 10303 application modules addressing interconnect placement, fabrication joints and functional specifications (neighboring part numbers in the 1600–1700 range), and later revisions of this same part. ISO/TS 10303-1670:2006 was revised and withdrawn in follow-up editions (notably a 2010 revision) and later consolidated into a subsequent published edition (ISO/TS 10303-1670:2018).
Keywords
STEP, ISO 10303, fabrication technology, interconnect substrate, layout template, layer stack, stratum stack model, product data representation, data exchange, PCB, CAM, CAD, application module.
FAQ
Q: What is this standard?
A: ISO/TS 10303-1670:2006 is a Technical Specification in the ISO 10303 (STEP) family that defines an application module for representing fabrication-technology information used in interconnect substrate and layout design.
Q: What does it cover?
A: It covers fabrication technology properties, layout pattern templates and their properties, and the definition of stratum (layer) stack models to represent technology-specific layer stackups and material combinations for data exchange and interoperability.
Q: Who typically uses it?
A: PCB and substrate designers, CAD/CAM tool vendors, manufacturing process engineers, and organizations that need standardized exchange of fabrication and layout technology data between systems.
Q: Is it current or superseded?
A: The 2006 edition is withdrawn. It was revised (a 2010 update is recorded) and later superseded by later published editions of the same part (notably an edition published in 2018). For implementation or procurement you should refer to the latest published edition of ISO/TS 10303-1670.
Q: Is it part of a series?
A: Yes — it is Part 1670 of the ISO 10303 series (STEP), a broad family of standards for computer-interpretable product data representation and exchange. Many related application modules occupy adjacent part numbers in the 1600–1700 range.
Q: What are the key keywords?
A: fabrication technology, interconnect substrate, layout pattern template, stratum stack model, STEP, ISO 10303, product data exchange, CAD/CAM interoperability.