ISO TS 10303-1676-2006 PDF

Full title and description

Industrial automation systems and integration — Product data representation and exchange — Part 1676: Application module: Functional decomposition to design. This technical specification (ISO/TS 10303-1676:2006) defines the STEP application module used to represent the assignment of functional units in a hierarchical network to elements in a physical design and the pin mapping between functional and packaged views.

Abstract

ISO/TS 10303-1676:2006 specifies an application module for "Functional decomposition to design." It covers the data required to record how functional units (from a functional/network view) are allocated to components in a physical/packaged design, and how terminal/pin mappings are represented and tracked, including cases where allocations or terminal mappings are swapped. The module is typically used by packaging and design tools and is expressed using STEP application module constructs and MIM/EXPRESS listings.

General information

• Status: Withdrawn (original 2006 edition withdrawn; later revisions published).
• Publication date: December 2006.
• Publisher: International Organization for Standardization (ISO).
• ICS / categories: 25.040.40 (Industrial process measurement and control / product data representation and exchange).
• Edition / version: Edition 1 (2006).
• Number of pages: 41 pages (original 2006 technical specification).

Scope

The standard defines the information requirements and module interpreted model (MIM) for representing the assignment of functional units in hierarchical network definitions to elements of a physical design definition, and the pin/terminal mapping between functional and packaged views. It also addresses identification of swapped allocations (functional unit allocated to a different physical component) and swapped terminal allocations. The module is intended to be used by packaging, library and design-exchange applications within the STEP/AP modular framework.

Key topics and requirements

• Representation of functional-to-physical allocation relationships (mapping functional units to physical design elements).
• Pin/terminal mapping between functional view and packaged/physical view (pin mapping semantics and storage in libraries).
• Identification and representation of allocation swapping (component-to-component or terminal-to-terminal swaps).
• ARM and MIM requirements: required application reference models, ARM type definitions, entity definitions and subtype constraints.
• Module Interpreted Model (MIM) and EXPRESS short listings to support implementation in STEP-based tools.

Typical use and users

Implemented by EDA and packaging tool vendors, PLM and CAD/CAE integrators, library maintainers, and systems engineers who need to exchange or persist mappings between functional network definitions and physical/package designs. Typical scenarios include packaging workflows, automated pin-mapping during placement/routing, verification of allocation swaps, and data exchange between functional design and physical implementation teams.

Related standards

Part of the ISO 10303 (STEP) family. Related parts and resources include other functional-decomposition modules (for assembly, interconnect, etc.), core STEP parts (ISO 10303-1 overview, ISO 10303-11 EXPRESS language, ISO 10303-21 clear text exchange), and the STEP Module and Resource Library (SMRL) for module/reuse guidance. Closely related application modules include ISO/TS 10303-1675 (functional decomposition to assembly design) and ISO/TS 10303-1677 (functional decomposition to interconnect design).

Keywords

STEP, ISO 10303, application module, functional decomposition, design allocation, pin mapping, terminal mapping, packaging, MIM, EXPRESS, allocation swap, product data representation.

FAQ

Q: What is this standard?

A: A STEP application module (ISO/TS 10303-1676:2006) that defines data structures and mappings for assigning functional units to physical design elements and recording pin/terminal mappings between functional and packaged views.

Q: What does it cover?

A: It covers the information requirements, ARM definitions, MIM/EXPRESS listings and semantics needed to represent functional-to-physical allocations, pin mappings, and identification of allocation/terminal swaps within packaging and design-exchange processes.

Q: Who typically uses it?

A: Tool vendors (packaging, EDA, PLM), library and component authors, systems and design engineers involved in mapping functional networks to physical implementations, and integrators exchanging STEP data.

Q: Is it current or superseded?

A: The 2006 edition is withdrawn and has later revisions. The module has been revised in subsequent releases (notably later ISO/TS 10303-1676 editions and related updates); users should consult the latest ISO/TS 10303-1676 edition for current text and status.

Q: Is it part of a series?

A: Yes — it is one application module within the ISO 10303 (STEP) family of standards, which is structured into application protocols, application modules, resource parts and implementation methods that together define product data representation and exchange.

Q: What are the key keywords?

A: Functional decomposition, allocation, pin mapping, terminal mapping, packaging, STEP, application module, MIM, EXPRESS, swap identification.