ISO TS 10303-410-2006 PDF

Full title and description

ISO/TS 10303-410:2006 — Industrial automation systems and integration — Product data representation and exchange — Part 410: Application module: AP210 electronic assembly interconnect and packaging design. This technical specification defines the AP210 application module used to represent electronic assemblies, interconnects and packaging design information for data exchange and long‑term product data management.

Abstract

ISO/TS 10303-410:2006 specifies an application module for AP210 that supports representation of requirements, design, configuration management, analytical model interfaces, connectivity and physical layout for electronic assemblies and interconnects. It covers both 2‑D and 3‑D assembly/interconnect design, supports microwave and embedded domains, and enables mapping between network listings and physical layout.

General information

• Status: Withdrawn.
• Publication date: December 2006.
• Publisher: International Organization for Standardization (ISO).
• ICS / categories: 25.040.40 (Industrial process measurement and control / product data representation and exchange).
• Edition / version: Edition 1 (2006).
• Number of pages: 149 (Edition 1, 2006).

Scope

The document defines information requirements and an interpreted model (module interpreted model) to support: hierarchical descriptions of functionality and functional objects; configuration management of concurrently developed functional objects and analytical models; explicit interfaces to analytical models that define behaviour; descriptions of device-to-device and functional-object connections; requirements for physical interconnection; physical placement and layout of components in assemblies; descriptions of bare interconnect (conductive and non‑conductive materials and patterns); material and usage characteristics of devices and physical objects; allocation of requirements to functional and physical implementations; and identification of planned and actual parameters for objects and models.

Key topics and requirements

• Representation of electronic assembly and interconnect functional and physical information (2‑D and 3‑D).
• Configuration management for designs, components and analytical models.
• Explicit mapping between network-level listings (logical connectivity) and physical layout.
• Support for multiple functional domains including analogue, digital, RF and microwave design.
• Definition of AM (application module) ARMs and MIM/EXPRESS listings for machine‑interpretable schemas and mappings.
• Allocation of requirements and constraints from functional objects to their physical realizations.

Typical use and users

Used by EDA/PCB and mechanical‑electrical CAD vendors, systems integrators, electronic packaging engineers, manufacturing and test engineers, and organizations exchanging electronic assembly and interconnect design data across the product lifecycle. Typical workflows include exchanging logical connectivity and BOM information, mapping network analyses to PCB/layout, configuration and change management of assembly descriptions, and linking analytic models to design elements for simulation and verification.

Related standards

Part of the ISO 10303 (STEP) family and specifically tied to the AP210 application protocol for electronic assembly, interconnect and packaging. ISO/TS 10303-410 has later revisions/editions (notably 2010) and a more recent published edition in 2023 that replaces earlier withdrawn editions. Other related STEP application protocols and domain models (for example product life‑cycle support and assembly technology constraints) are commonly referenced when integrating AP210 data with broader PLM/maintenance and manufacturing information.

Keywords

ISO 10303, STEP, AP210, electronic assembly, interconnect, packaging design, EXPRESS, MIM, ARM, configuration management, PCB, EDA, product data exchange.

FAQ

Q: What is this standard?

A: ISO/TS 10303-410:2006 is a technical specification defining an AP210 application module for representing electronic assembly, interconnect and packaging design information for data exchange and lifecycle management.

Q: What does it cover?

A: It covers information requirements and an interpreted model to describe functionality, connections, physical layout, materials, configuration management, analytic model interfaces, and allocation of requirements across functional and physical design representations for electronic assemblies and interconnects.

Q: Who typically uses it?

A: CAD/EDA software vendors, electronic packaging and PCB designers, manufacturing and test engineers, systems integrators, and organizations that need standardized exchange of assembly/interconnect design and configuration data.

Q: Is it current or superseded?

A: The 2006 edition is withdrawn and has been superseded by later editions (an Edition 2 in 2010 was issued and later revisions culminated in a published edition in 2023). For production use, reference the latest published edition (for example the 2023 edition).

Q: Is it part of a series?

A: Yes — it is Part 410 of the ISO 10303 series (STEP). The series contains many parts (application protocols, modules and domain models) that together support comprehensive product data representation and exchange across industries.

Q: What are the key keywords?

A: AP210, STEP, electronic assembly, interconnect, PCB, packaging design, EXPRESS, MIM, ARM, configuration management, product data exchange.