DIN EN 123200 1992-11 PDF

Full title and description

STB DIN EN 123200:1992-11 — Capability detail / sectional specification: single and double sided printed boards with plated-through holes. This listing appears in some commercial catalogues and national adoptions as "STB DIN EN 123200 1992-11" (German-language version of EN 123200:1992), and is intended as the national/DIN presentation of the EN text for quality assessment and capability approval of single- and double-sided printed circuit boards with metallised (plated-through) holes.

Abstract

This standard (EN 123200:1992 and its national/DIN presentation) is a sectional/capability detail specification that defines the requirements, test patterns and inspection procedures used when qualifying suppliers and inspecting production of single- and double-sided printed circuit boards with plated-through holes. It covers capability approval, quality conformance inspection, test specimens and characteristic requirements for the conductive pattern and plated holes. The EN text was later issued with an Amendment (EN 123200:1992/A1:1995).

General information

• Status: Withdrawn / superseded in practice; national listings indicate the document has been withdrawn or replaced by later capability-detail specifications.
• Publication date: 1992-11 (EN 123200:1992 — German/DIN edition commonly cited as 01 November 1992 / 1992-11). An associated amendment (EN 123200:1992/A1) was issued in 1995.
• Publisher: European Committee for Standardization (CEN/CENELEC alignment for electrical/electronics work) — national German adoption published via DIN as the German version of EN 123200.
• ICS / categories: 31.180 — Printed circuits and boards (electronics assembly / printed circuit board quality assessment).
• Edition / version: EN 123200:1992 (German/DIN presentation 1992-11); amended by EN 123200:1992/A1:1995 (national adoptions may show slightly different edition identifiers).
• Number of pages: Varies by national publication and language version (catalogue entries show typical ranges between ~16 and ~32 pages depending on the national format and whether amendment text is included). Users should check the specific national/DIN publication for exact page count.

Scope

The standard applies to single- and double-sided printed circuit boards with plated-through holes and provides the framework for capability approval and quality conformance inspection of such boards. It specifies general characteristics, required test specimens and test patterns (including composite test patterns), outlines capability test programmes and describes the procedures for assessing a manufacturer's ability to meet the stated quality requirements. It is intended to be used as a sectional/detail specification within harmonized quality-assessment systems for electronic components.

Key topics and requirements

• Definitions and general requirements for single- and double-sided printed boards with plated-through holes (characteristics of conductive pattern and metallized holes).
• Capability approval: requirements and test programmes to qualify a supplier’s manufacturing process.
• Quality conformance inspection: sampling, test specimens and acceptance checks during production.
• Test patterns and test boards: composite test pattern (CTP) and arrangements for evaluating process capability and reproducibility.
• Relevant test methods, reference documents and cross-references to related CECC / IEC guidance used for printed-board testing.

Typical use and users

Primary users are PCB manufacturers, quality managers, procurement engineers, inspection and test laboratories, and customers specifying capability approval evidence as part of supplier qualification. The document is used when establishing capability detail specifications for procurement and when conducting capability tests and quality-conformance inspections of single- and double-sided plated-through-hole printed boards.

Related standards

Commonly linked and referenced documents include the amendment EN 123200:1992/A1:1995 and various CECC capability-detail specifications (for example CECC 23 200 series), plus IEC publications on printed boards and test methods (e.g., IEC references consolidated into more recent printed-board design and test standards). Users often consult national adoptions (BS EN, DIN EN, UNE-EN, STN/other national editions) for local implementation details.

Keywords

Sectional specification; Capability approval; Printed boards; Printed-circuit boards; Single-sided; Double-sided; Plated-through holes; Quality conformance inspection; Test patterns; Composite test pattern (CTP); Capability test programme.

FAQ

Q: What is this standard?

A: EN 123200:1992 (presented here as the DIN/ national listing 1992-11) is a sectional/capability-detail specification for single- and double-sided printed circuit boards with plated-through holes, used to define capability approval and quality-inspection requirements.

Q: What does it cover?

A: It covers general characteristics of printed boards, requirements for capability approval, quality conformance inspection procedures, test specimens and specific test patterns (including composite test patterns), plus guidance on capability test programmes and acceptance checks.

Q: Who typically uses it?

A: PCB manufacturers, OEMs and their procurement/quality departments, test laboratories and certification bodies use this kind of capability-detail specification when qualifying suppliers and inspecting printed boards.

Q: Is it current or superseded?

A: The EN 123200:1992 text has been amended (EN 123200:1992/A1:1995) and many national listings indicate withdrawal or replacement by later CECC/EN capability-detail specifications. Users should confirm the current national status before applying the document for regulatory or contractual purposes.

Q: Is it part of a series?

A: Yes — it forms part of a harmonized system of quality assessment and capability-detail specifications for electronic components and printed boards (CECC/EN family and related national adoptions). Related CECC/EN documents cover other classes of printed boards and multilayer constructions.

Q: What are the key keywords?

A: Capability approval, quality conformance inspection, printed boards, plated-through holes, test patterns, composite test pattern (CTP), capability test programme.