ASTM E1457-23e1 PDF

SIGNIFICANCE AND USE 6.1 Creep crack growth rate expressed as a function of the steady state C* or K characterizes the resistance of a material to crack growth under conditions of extensive creep deformation or under brittle creep conditions. Background information on the rationale for employing the fracture mechanics approach in the analyses of creep crack growth data is given in (11, 13, 30-35). 6.2 Aggressive environments at high temperatures can significantly affect the creep crack growth behavior. Attention must be given to the proper selection and control of temperature and environment in research studies and in generation of design data. 6.2.1 Expressing CCI time, t0.2 and CCG rate, da/dt as a function of an appropriate fracture mechanics related parameter generally provides results that are independent of specimen size and planar geometry for the same stress state at the crack tip for the range of geometries and sizes presented in this document (see Annex A1). Thus, the appropriate correlation will enable exchange and comparison of data obtained from a variety of specimen configurations and loading conditions. Moreover, this feature enables creep crack growth data to be utilized in the design and evaluation of engineering structures operated at elevated temperatures where creep deformation is a concern. The concept of similitude is assumed, implying that cracks of differing sizes subjected to the same nominal C*(t), Ct, or K will advance by equal increments of crack extension per unit time, provided the conditions for the validity for the specific crack growth rate relating parameter are met. See 11.7 for details. 6.2.2 The effects of crack tip constraint arising from variations in specimen size, geometry and material ductility can influence t0.2 and da/dt. For example, crack growth rates at the same value of C*(t), Ct in creep-ductile materials generally increases with increasing thickness. It is therefore necessary to keep the component dimensions in mind when selecti... SCOPE 1.1 This test method covers the determination of creep crack initiation (CCI) and creep crack growth (CCG) in metals at elevated temperatures using pre-cracked specimens subjected to static or quasi-static loading conditions. The solutions presented in this test method are validated for base material (that is, homogenous properties) and mixed base/weld material with inhomogeneous microstructures and creep properties. The CCI time, t0.2, which is the time required to reach an initial crack extension of δai = 0.2 mm to occur from the onset of first applied force, and CCG rate, a˙ or da/dt are expressed in terms of the magnitude of creep crack growth correlated by fracture mechanics parameters, C* or K, with C* defined as the steady state determination of the crack tip stresses derived in principal from C*(t) and Ct (1-17).2 The crack growth derived in this manner is identified as a material property which can be used in modeling and life assessment methods (17-28). 1.1.1 The choice of the crack growth correlating parameter C*, C*(t), Ct, or K depends on the material creep properties, geometry and size of the specimen. Two types of material behavior are generally observed during creep crack growth tests; creep-ductile (1-17) and creep-brittle (29-44). In creep ductile materials, where creep strains dominate and creep crack growth is accompanied by substantial time-dependent creep strains at the crack tip, the crack growth rate is correlated by the steady state definitions of Ct or C*(t) , defined as C* (see 1.1.4). In creep-brittle materials, creep crack growth occurs at low creep ductility. Consequently, the time-dependent creep strains are comparable to or dominated by accompanying elastic strains local to the crack tip. Under such steady state creep-brittle conditions, Ct or K could be chosen as the correlating parameter (8-14). 1.1.2 In any one test, two regions of crack growth behavior may be present (12, 13)....