BS EN 60191-6-22:2013 PDF

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon…

Название (английский):

BS EN 60191-6-22:2013

Статус документа:: Действующий
Формат:: Электронный (PDF)
Дата публикации:: 30 апреля 2013 г.
ICS:: 31.080.01
Технический комитет:: CENELEC
SKU:: BS EN 60191-6-22:2013

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Abstract

What is BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages about?

BS EN 60191-6-22 is the sixth part of a multi-series standard used for the mechanical standardization of semiconductor devices. This helps in designing and manufacturing good quality surface mounted semiconductor device packages. BS EN 60191-6-22 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Who is BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages for?

BS EN 60191-6-22:2013 PDF

Abstract

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Abstract

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