Solderless connections - Compression mount connections. General requirements, test methods and practical guidance
Solderless connections - Compression mount connections. General requirements, test methods and practical guidance
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1 Scope and object This part of IEC 60352 is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.
Упомянутые в описании и другие стандарты BS