Printed board assemblies - Sectional specification. Requirements for through-hole mount soldered assemblies
Printed board assemblies - Sectional specification. Requirements for through-hole mount soldered assemblies
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What is BS EN 61191-3 - Printed board assemblies about?
BS EN 61191 is an international standard that discusses printed board assemblies. The main objective of the BS EN 61191 series is to provide manufacturers of printed board assemblies with best industry guidance on ensuring their products play a positive role in the functioning of electronic applications. BS EN 61191-3 is the third part of the multi-series that provides requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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