Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
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What is BS EN 61191-6 - Evaluation of voids in BGA and LGA soldered connections about?
BS EN 61191-6 is the sixth part of a multi-series standard used for Printed board assemblies that specifies the measuring methods for voids in soldered joints of BGA and LGA. BS EN 61191-6 is useful in evaluating these voids that results in manufacturing good quality printed boards. BS EN 61191-6 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA...
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