Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
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BS EN 61760-3:2010 Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering BS EN 61760-3 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of BS EN 61760-3 is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology. Contents of BS EN 61760-3: Scope and object 2 Normative references 3 Terms and definitions 4 Requirements to component design and component specifications 4.1 General requirement 4.2 Packaging 4.3 Labelling of product packaging 4.4 Component marking 4.5 Storage and transportation 4.6 Component outline and design 4.6.1 Drawing and specification 4.6.2 Pick-up area requirements 4.6.3 Bottom surface requirements 4.6.4 Requirements to terminals 4.6.5 Component height 4.6.6 Component we...
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