Semiconductor devices. Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
Semiconductor devices. Micro-electromechanical devices - Axial fatigue testing methods of thin film materials
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1 Scope This International Standard specifies the method for axial tensile–tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 μm and 10 μm under constant force range or constant displacement range . Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.
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