Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint - Cyclic drop test
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What is BS EN 62137-1-3 – Cyclic drop test for surface mount solder joint about?
BS EN 62137-1-3 is an international standard that focuses on cyclic drop test and environmental endurance test methods for the surface mount solder joint. BS EN 62137-1-3 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). BS EN 62137-1-3 stipulates the technicalities such as related terms and definitions, test equipment and materials, mounting method, test method and procedure, and judgment conditions, items to be included in the test report, as well as items to be given in the product specification.
Who is BS EN 62137-1-3 - Cyclic drop test for surface mount solder joint for ?
BS EN 62137-1-3 on cyclic drop test for the surface mount solder joint is useful for:
PCB manufacturers and suppliers Research and Development in electronics Quality assurance entities Manufacturers and suppliers of e...
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