Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
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What is EN 62137-3 - Selecting the test methods for solder joints used in electronic components about?
BS EN 62137-3 is the third part of multi-series standard used for Electronics assembly technology that specifies the test methods and test procedure for solder joints. BS EN 62137-3 can be your best guide in selecting the test method for solder joints used in electronic devices. BS EN 62137-3 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
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