Semiconductor devices — Mechanical and climatic test methods - Bond strength — wire bond pull test methods
Semiconductor devices — Mechanical and climatic test methods - Bond strength — wire bond pull test methods
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1 Scope This part of IEC 60749 provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and can be performed on unencapsulated or decapsulated devices. This test method can be performed on gold alloy, copper alloy, and silver alloy thermosonic (ball and stitch) bonds made of wire ranging in diameter from 15 µm to 76 µm (0,000 6" to 0,003"); and on gold alloy, copper alloy, and aluminium alloy ultrasonic (wedge) bonds made of wire ranging in diameter from 18 µm to 600 µm (0,000 7" to 0,024"). This wire bond pull test method is destructive. It is appropriate for use in process development, process control, or quality assurance. This test method allows for two distinct methods of pulling wires:
One method incorporates the use of a hook that is placed under the wire and is then pulled. One method requires that after the wire be cut, a clamp is placed on the wire connected to the bond to be tested, and this clamp is used to pull the wire.
This test method defines three pull tests. The wire pull test (WPT) is appropriate for all bonded wires. The ball pull test (BPT) and stitch pull test (SPT) are appropriate for thermosonically bonded wires.
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