BS EN IEC 61189-3-302:2025 PDF
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
Название (английский):
BS EN IEC 61189-3-302:2025
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
- Статус документа:
- Действующий
- Формат:
- Электронный (PDF)
- Дата публикации:
- 30 ноября 2025 г.
- ICS:
- 31.180
- Технический комитет:
- CENELEC
- SKU:
- BS EN IEC 61189-3-302:2025