Device embedding assembly technology - Generic specification for device embedded substrates
Device embedding assembly technology - Generic specification for device embedded substrates
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What is BS EN IEC 62878-1 – Assembling device embedded substrates about?
BS EN IEC 62878 ‑ 1 is the first part of the international standard used for device embedding assembly technology that specifies the requirements and test methods for device embedded substrates. BS EN IEC 62878 ‑ 1 best practice guidelines can help you in applying safety requirements while performing the test method. BS EN IEC 62878 ‑ 1 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3 . BS EN IEC 62878 ‑ 1 is applicable to device-embedded substrates fabricated by the use of the organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. Note: BS EN IEC 62878 ‑
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