BS EN IEC 62878-2-603:2025 PDF

Device embedding assembly technology - Guideline for stacked electronic module. Test method of intra-module electrical connectivity

Название (английский):

BS EN IEC 62878-2-603:2025

Device embedding assembly technology - Guideline for stacked electronic module. Test method of intra-module electrical connectivity

Статус документа:: Действующий
Формат:: Электронный (PDF)
Дата публикации:: 30 апреля 2025 г.
ICS:: 31.180
Технический комитет:: CENELEC
SKU:: BS EN IEC 62878-2-603:2025

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Abstract

1 Scope

This part of IEC 62878 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as " known good module " ( KGM ).

BS EN IEC 62878-2-603:2025 PDF

Abstract

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Abstract

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