Printed electronics - Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics - Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
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What is BS IEC 62899-202-5 - conductive ink mechanical bending test about?
Printing technologies are widely used for the development of flexible and stretchable electronics as they offer a cost-effective fabrication alternative to traditional approaches. A printed conductive layer on an insulating substrate can be employed as an electrode or as an interconnect for flexible devices. BS IEC 62899-202-5 guidelines enable you to determine the bending capacity of printed conductive layers. BS IEC 62899-202-5 specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation. This sliding plate test method can be availed for practical application in the industry by enabling the long-term reliability testing of printed film.
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