ISO 10303-210-2021 PDF

Full title and description

Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect and packaging design (ISO 10303-210:2021). This application protocol (AP 210) defines a STEP-based information model for exchange of electronic and electro-mechanical assembly, interconnect and packaging design data to support design, analysis and manufacturing planning.

Abstract

ISO 10303-210:2021 specifies the integrated resources and information constructs required to share detailed design and related requirements for assemblies and interconnect substrates so they can be transformed into manufacturable or analysable descriptions. It supports exchange of device and component characterization, multi-domain sub-model relationships (electrical, thermal, mechanical), 2D/3D shape representations, tolerances, and presentation/drawing information for electronic assemblies and packaging.

General information

• Status: Published (International Standard).
• Publication date: March 2021.
• Publisher: International Organization for Standardization (ISO).
• ICS / categories: 25.040.40 (Industrial process measurement and control / product data representation and exchange).
• Edition / version: Edition 4 (2021).
• Number of pages: 81 pages.

Key bibliographic and lifecycle metadata above are taken from the ISO bibliographic entry for ISO 10303-210:2021.

Scope

AP 210 defines the use of ISO 10303 integrated resources to represent configuration-control and characterization data for electronic assemblies, interconnects and packaging. In-scope items include configuration and catalog data, component and material characterization (including chemical/composite composition and surface conditions), electrical and mechanical part data (including bare semiconductor devices, connectors and cables), multi-domain model descriptions (electrical, thermal, mechanical) with explicit relationships to maintain consistency, 2D and 3D shape representations with geometric validation and tolerances, fabrication panel descriptions for substrate manufacturing, and presentation/drawing information. Items outside the scope are described in the standard's annexes and related APs.

Key topics and requirements

• STEP-based EXPRESS schema and integrated resources to represent electronic assembly and packaging data.
• Representation of multi-domain sub-models (electrical, thermal, mechanical) and their explicit relationships to ensure cross-domain consistency.
• Component and catalog data modeling, including units, derived units and tabular characteristic data for electronic components.
• 2D and 3D geometry and presentation (drawings), geometric validation properties and tolerance representation.
• Data constructs for fabrication planning: substrate panel descriptions, interconnect manufacturing information and related metadata for downstream processes.

Typical use and users

Typical users include design engineers and device designers, interconnect and packaging engineers, manufacturing and fabrication planning engineers, design analysts, value-added data suppliers, system engineers, and configuration/data management teams who must exchange or archive electronic assembly and packaging data between heterogeneous CAD/EDA/PLM systems. AP 210 is used for data exchange, long-term archiving of electronic product data and for enabling downstream manufacturing and analysis workflows.

Related standards

ISO 10303-210 is one part of the ISO 10303 (STEP) series of standards for product data representation and exchange. Related and neighboring APs include AP 209 (composite and structural analysis), AP 212 (electrotechnical design and installation), AP 214/AP 242 (core mechanical and managed model-based engineering) and other STEP parts defining EXPRESS, file formats and XML representations (for example Parts 11, 21 and 242). Implementers often use AP 210 together with core integrated resources from other ISO 10303 parts to cover lifecycle and manufacturing needs.

Keywords

AP 210, ISO 10303-210, STEP, electronic assembly, interconnect design, packaging design, EXPRESS schema, product data exchange, CAD/EDA interoperability, manufacturing planning, component catalog data.

FAQ

Q: What is this standard?

A: ISO 10303-210:2021 (AP 210) is an ISO application protocol in the STEP family that defines a data model and usage rules for exchanging electronic assembly, interconnect and packaging design information.

Q: What does it cover?

A: It covers representation of component and assembly characterization data, multi-domain sub-models (electrical/thermal/mechanical), 2D/3D geometry and drawings, tolerances, catalog and configuration-control data, and fabrication-related descriptions for substrates and interconnects.

Q: Who typically uses it?

A: Design and device engineers, interconnect and packaging designers, manufacturing/fabrication planners, analysis engineers, data suppliers and PLM integrators who need to exchange or archive detailed electronic product and process data.

Q: Is it current or superseded?

A: ISO 10303-210:2021 is the current published edition (Edition 4) as of March 2021; earlier editions (for example the 2014 edition) were superseded by the 2021 publication. Users should check ISO renewal or amendment notices for any updates after 2021.

Q: Is it part of a series?

A: Yes — it is Part 210 of the ISO 10303 (STEP) series of standards; AP 210 is one of many application protocols in the STEP family that together support product data representation and exchange across industries.

Q: What are the key keywords?

A: Electronic assembly, interconnect, packaging, STEP, AP 210, product data exchange, EXPRESS schema, CAD/EDA interoperability, component catalog, fabrication planning.