ISO TS 10303-1677-2006 PDF

Full title and description

Industrial automation systems and integration — Product data representation and exchange — Part 1677: Application module: Functional decomposition to interconnect design (ISO/TS 10303-1677:2006). This technical specification defines an application module within the STEP (ISO 10303) family that supports representation of assignments of functional units in hierarchical network definitions to elements of interconnect substrate and the rules for swapping between gates and terminals in interconnect designs.

Abstract

ISO/TS 10303-1677:2006 specifies data constructs and relationships required to describe allocation of functional units in network definitions to transmission lines or fabrication joint lines in interconnect designs, and it defines the permitted types of swapping (within a printed part instance, between identical gates in different instances, and between terminals of identical type and behaviour). The module is intended for use as part of STEP-based product data exchange for interconnect/PCB and electronic-substrate design.

General information

• Status: Published (Technical Specification; confirmed as current through periodic ISO review).
• Publication date: December 2006 (Edition 1, 2006-12).
• Publisher: ISO (International Organization for Standardization), TC 184/SC 4.
• ICS / categories: 25.040.40 (Industrial automation systems and integration — Product data representation and exchange).
• Edition / version: Edition 1 (ISO/TS 10303-1677:2006).
• Number of pages: 39 pages.

Key bibliographic and lifecycle details above are taken from the official ISO record for ISO/TS 10303-1677:2006.

Scope

This application module specifies the information needed to describe assignment (allocation) of a functional unit defined in a hierarchical network to specific elements of an interconnect substrate design. It covers allocation to transmission lines and to fabrication joint lines in the interconnect design and defines the various types of swapping allowed within designs (gate-to-gate within a single printed part, between identical gates in different instances of a printed part, and between terminals of identical type and behaviour). The module is intended to be used within STEP-based data exchange and integration flows for electronic/interconnect design.

Key topics and requirements

• Data model for mapping functional units (from hierarchical network definitions) to interconnect design elements (transmission lines, joint lines).
• Definitions and rules for performing swapping operations between gates and terminals within and across printed part instances.
• Application-module level constructs consistent with the ISO 10303 (STEP) schema methodology to ensure interoperability between tools.
• Requirements for representing allocation relationships, identifiers, and behavioural equivalence for interchangeable terminals/gates.
• Intended use as a reusable module to be combined with other STEP application modules or protocols for complete product-data exchange.

Typical use and users

Typical users include EDA and PCB tool vendors, systems integrators, PLM and PDM implementers, electronics design engineers, and standards/interop engineers who need a standardized representation for mapping logical functional networks to physical interconnect substrates and for documenting allowable swapping behaviors in manufacturing and assembly contexts. The module is used when STEP-based exchange of interconnect/allocation information is required between CAD/EDA and downstream systems.

Related standards

ISO/TS 10303-1677:2006 is part of the ISO 10303 (STEP) family of standards for product data representation and exchange. Related parts include other application modules and APs within the 10303 series that cover electronic design, application protocols, and implementation methods (EXPRESS, STEP-File, AP modules, and neighbouring TS parts in the 167x series). Several companion technical specifications in the 10303-167x range were published and reconfirmed in ISO periodic reviews.

Keywords

ISO 10303, STEP, application module, functional decomposition, interconnect design, allocation, swapping, transmission line, fabrication joint line, PCB, EDA, product data exchange.

FAQ

Q: What is this standard?

A: ISO/TS 10303-1677:2006 is a STEP application module (Technical Specification) that defines data constructs for assigning functional units in hierarchical network definitions to elements of interconnect substrate designs and for describing swapping behaviour.

Q: What does it cover?

A: It covers representation of allocation of functional units to transmission lines and fabrication joint lines in interconnect designs and the types of swapping allowed between gates and terminals (within a printed part instance, between identical gates in different instances, and between terminals of identical type and behaviour).

Q: Who typically uses it?

A: EDA/PCB tool vendors, electronics design and integration engineers, PLM/PDM implementers, and standards/interop teams that require STEP-based data exchange for interconnect allocation and swapping semantics.

Q: Is it current or superseded?

A: The specification was published in December 2006 (Edition 1) and has been subject to ISO's periodic review process; the ISO record shows it confirmed and maintained in the ISO lifecycle (confirmed during reviews), so the 2006 version remains the published Technical Specification unless superseded by a later ISO action. Users should check the ISO catalogue or national standards body for the absolute latest status before procurement or formal citation.

Q: Is it part of a series?

A: Yes — it is part of the ISO 10303 (STEP) family. ISO 10303 is organized into many parts including application protocols, application modules, and implementation methods; ISO/TS 10303-1677 is one of the application modules in the 1001–1999 and 1600s ranges that support domain-specific data exchange.

Q: What are the key keywords?

A: STEP, application module, functional decomposition, interconnect, allocation, swapping, PCB, EDA, ISO 10303, product data exchange.