Printed boards - Device embedded substrate. Terminology / reliability / design guide
Printed boards - Device embedded substrate. Terminology / reliability / design guide
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What is DD IEC/PAS 62326-14 - Design guide for Printed boards about?
DD IEC/PAS 62326-14 is the 14th part of a multi-series standard used for printed boards. DD IEC/PAS 62326-14 describes the substrate embedding devices including but not limited to the module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. Figure 1 shows examples of device embedding in the fabrication process of the device embedded substrate. Active and passive devices are connected to each other by interlayer vias and/or conductor patterns. Insulating layers are formed using insulating materials with vias for the connection of inside conductor patterns to the conductor patterns formed on the surface(s) of the substrate. Figure 2 shows the substrate with connections using pads, and Figure 3 shows the board using via connections. The insulating layer includes rigid and flexible insulating resins such as phenol resin, epoxy resin, polyimide resin, and modified polyimide resin, which are reinforced with glass cloth,
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