IEC 61192-4:2002 PDF
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Название (английский):
IEC 61192-4:2002
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
- Статус документа:
- Отменён
- Формат:
- Электронный (PDF)
- Количество страниц:
- 59
- Дата публикации:
- 29 ноября 2002 г.
- Издание:
- IEC IS 61192 edition 1 version 1
- ICS:
- 31.190
Описание (английский):
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Технические детали
- Технический комитет
- TC 91 - Electronics assembly technology
- SKU
- IEC 61192-4:2002