Overview
IEC 62433-3:2017, developed by the International Electrotechnical Commission (IEC), is a key international standard for electromagnetic compatibility (EMC) integrated circuit (IC) modelling. Titled "EMC IC Modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)," this standard provides a comprehensive method for deriving macro-models allowing for the simulation of radiated emissions from integrated circuits. The ICEM-RE (Integrated Circuit Emission Model - Radiated Emission) enables professionals to analyze and predict the radiated emission levels from complete ICs, functional blocks, and intellectual property (IP) blocks, both analog and digital, when direct import of measured or simulated emission data is not feasible.
With the rise in complexity and integration density of modern ICs, as well as increased board-level component density, the risk of unwanted radiated emissions affecting system performance is continually growing. IEC 62433-3:2017 allows designers and engineers to proactively address potential EMC issues at the IC and system level using standardized modelling and simulation techniques.
Key Topics
- ICEM-RE Macro-Modeling: Provides detailed guidelines for building macro-models to simulate radiated emissions from ICs, including package and block-level modelling.
- Data Exchange Format (REML): Introduces the Radiated Emissions Markup Language (REML), an XML-based universal exchange format for encoded ICEM-RE models, enhancing interoperability between design and simulation tools.
- Practical Model Components: Covers modelling of both passive distribution networks (PDN) and internal activities (IA) within ICs, addressing input/output pins, digital cores, and power supply structures.
- Simulation Integration: Enables the integration of IC emission models into 3D electromagnetic simulation tools for accurate emission prediction and analysis.
- Model Extraction and Validation: Details methodologies for extracting model parameters from measurement data and validating the effectiveness of the resulting emission models.
- File Structure and Syntax: Specifies the structure, hierarchy, and required syntax of model files to ensure consistency and proper tool interpretation.
Applications
- IC and PCB Design: Assists integrated circuit designers and PCB engineers in predicting and mitigating radiated EMC problems early in the design cycle, leading to more robust and compliant electronic systems.
- Automotive and Industrial Electronics: Used in industries where electromagnetic interference (EMI) can lead to functional safety concerns, such as automotive ECUs or industrial automation equipment.
- Consumer Electronics: Helps prevent EMC-related product malfunctions in densely integrated consumer devices.
- Simulation and System-level EMC Analysis: Provides standardized models for simulating how an IC’s emissions may impact surrounding components, cables, and system assemblies.
- Intellectual Property (IP) Block Assessment: Enables thorough EMC evaluation of third-party silicon IP blocks used in custom system-on-chip (SoC) designs.
Related Standards
For a comprehensive EMC modelling approach, IEC 62433-3:2017 should be used in conjunction with:
- IEC TS 62433-1: EMC IC Modelling – Part 1: General modelling framework
- IEC 62433-2: EMC IC Modelling – Part 2: Conducted emissions modelling (ICEM-CE)
- IEC 61967-1: Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 1: General conditions and definitions
- IEC TS 61967-3: Integrated circuits – Measurement of electromagnetic emissions – Part 3: Radiated emissions – Surface scan method
Practical Value
Implementing IEC 62433-3:2017 helps ensure compliance with global EMC requirements, streamlines the integration of IC emission models into complex system designs, and supports effective communication between manufacturers, system integrators, and simulation software vendors using standardized modelling and data exchange practices. This results in improved product reliability, reduced EMC testing costs, and faster time-to-market for sophisticated electronic systems.