Overview
IEC PAS 63720:2026 establishes standardized routing parameter tables for the design of rigid circuit boards with mechanically or laser drilled vias. These tables are based on the concept of "Routing Classes," enabling better alignment between electronic component pitches (such as BGA, QFN, connectors) and design rules for printed circuit boards (PCBs). The standard supports seamless integration into electronic design automation (EDA) tools and enhances communication between designers, customers, and manufacturers. Importantly, Routing Classes should not be confused with IPC performance classes related to PCB acceptance and qualification standards like IPC-A-600 and IPC-6012.
Key Topics
- Routing Classes:
Routing Classes (RC) range from RC1 to RC10 and provide a consistent set of design rules tailored for different component densities and manufacturing complexities. Higher RC levels allow greater component density but involve increased fabrication challenges.
- Parameter Conventions:
Routing parameters are grouped (e.g., mechanical, conductor, via, solder mask) and identified using a two-letter scheme (e.g., ME for Mechanical, CO for Conductor).
- Integration with EDA Tools:
The standard's routing tables and classification system are designed for easy use within EDA software, streamlining the PCB layout and design process.
- Compatibility and Communication:
Routing Classes offer a standard language for specifying PCB design requirements, ensuring consistency throughout the supply chain.
- Separation from IPC Classes:
Routing Classes define design feasibility and manufacturability, while IPC performance classes address end-product acceptance and reliability.
Applications
IEC PAS 63720:2026 is valuable across the electronics manufacturing sector, particularly for:
- PCB Designers:
Designers use the routing parameter tables to select appropriate Routing Classes based on component packaging and required electrical performance, ensuring designs are manufacturable and cost-effective.
- Component and Circuit Board Manufacturers:
Manufacturers use Routing Classes to standardize quoting, improve communication, and align manufacturing processes with customer requirements.
- EDA Software Integration:
Design teams leverage the standardized parameters for automating rule checks and routing constraints, minimizing errors and design iterations.
- Procurement and Quality Teams:
Provides a reference for evaluating supplier capabilities and ensuring consistency in board fabrication processes.
Example usage scenarios include:
- Designing dense, high-performance boards with matrix components like BGAs.
- Aligning PCB design constraints with state-of-the-art manufacturing capabilities and component pitches.
- Documenting and communicating routing requirements in multi-vendor environments.
Related Standards
For comprehensive circuit board design, IEC PAS 63720:2026 should be used in conjunction with related industry standards:
- IPC-A-600: Acceptability of Printed Boards - performance criteria and acceptance standards.
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards.
- IPC-2221: Generic Standard on Printed Board Design.
- IPC-2222: Sectional Design Standard for Rigid Organic Printed Boards.
- IPC-2226: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards.
These related standards provide guidance on acceptance, qualification, and design requirements that complement the routing parameter focus of IEC PAS 63720:2026.
IEC PAS 63720:2026 delivers a unified approach to specifying routing parameters for rigid circuit boards, supporting efficiency, predictability, and quality in PCB design and manufacturing. By adopting its Routing Classes and conventions, organizations facilitate improved collaboration, reduce time-to-market, and mitigate risks associated with design-manufacturing mismatches in the global electronics supply chain.
